|
 |
PEEK™ Extended Properties
| General |
|
Methods |
Units |
|
|
| Relative Density |
(Crystalline)
(Amorphous) |
ASTM D792
ASTM D792 |
-
- |
1.30
1.26 |
| Typical Level of Crystallinity |
|
- |
% |
30-35 |
| Mold Shrinkage |
|
- |
% |
1.0-1.8 |
| Water Absorption |
24 hr. @ 73°F
Equilibrium @ 73°F |
ASTM D570
ISO R62A |
%
% |
0.50
0.50 |
| |
|
|
|
|
| Mechanical |
|
Methods |
Units |
|
|
| Tensile Strength |
@ 73°F (yield)
@ 482°F (yield) |
ASTM D638 (5mm/min)
ASTM D638 (5mm/min) |
psi
psi |
14,000
1,750 |
| Elongation at Break |
@ 73°F |
ASTM D638 (5mm/min) |
% |
>50 |
| Elongation at Yield |
@ 73°F |
ASTM D638 (5mm/min) |
% |
4.9 |
| Flexural Modulus: |
@ 73°F
@ 248°F
@ 482°F |
ASTM D790
ASTM D790
ASTM D790 |
psi
psi
psi |
594,000
580,100
43,500 |
| Flexural Strength |
@ 73°F
@ 248°F
@ 482°F |
ASTM D790
ASTM D790
ASTM D790 |
psi
psi
psi |
24,650
14,500
1,800 |
| IZOD Impact Strength |
@ 73°F
Notched
Unnotched |
ASTM D256 |
ft.-lb./in. |
1.57
No Break |
| |
|
|
|
|
| Thermal |
|
Methods |
Units |
|
|
| Melting Point |
|
DSC |
°F (°C) |
644(340) |
| Glass Transition Temperature, Tg
(onset value) |
|
DSC |
°F (°C) |
289(143) |
| Melt Flow Index |
400°C/2.16 kg |
ASTM D1238 |
g/10 min. |
4 |
| Coefficient of Thermal Expansion:
|
<Tg
>Tg |
ASTM D696
ASTM D696 |
10-5°F-1 |
2.6
6 |
| Heat Deflection Temperature, 264 psi |
|
ASTM D648 |
°F (°C) |
320(160) |
| UL Continuous Use Temperature |
Mechanical
Electrical |
|
|
464(240)
500(260) |
| |
|
|
|
|
| Sterilization |
|
Methods |
Units |
|
|
| 200 steam cycles at 280°F |
short time, 1/8" thick |
- |
- |
No Effect |
| 1000 Mrads gamma radiation |
|
- |
- |
No Effect |
| Chemicals (ethylene oxide, etc.) |
|
- |
- |
No Effect |
| Heat up to 500°F |
|
- |
- |
No Effect |
| |
|
|
|
|
| Electrical |
|
Methods |
Units |
|
|
| Dielectric Strength (50µ film) |
|
ASTM D149 |
KV/cm |
190 |
| Dielectric Constant |
50Hz-10kHz, 0-300°F
50Hz, 392°F |
|
- |
3.20-3.30
4.50 |
| Special Notes |
|
| Chemicals which interact with PEEK polymer are
not pH dependent; rather, interaction is more determined by
other physical properties of the chemical(s) in question. Not
recommended for use with nitric acid; sulfuric acid; halogenated
acids, such as hydrofluoric, hydrobromic, and hydroiodic acids
(hydrochloric acid is approved for most applications); and pure
halogenated gases. Additionally, due to a swelling effect, be
cautious in using the following solvents with PEEK tubing: methylene
chloride, THF, and DMSO. |
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